Integration of organic lasers on a silicon photonic chip

Date: 2018-05-31 06:39:00 From: C-light Onclick:

Fraunhofer HHI, one of the world’s leading research institutes of optical components, is pleased to announce a novel double-side electroabsorption modulated DFB laser (DS-EML). This chip, co-developed with Huawei, integrates EAMs at both sides of a single DFB which allows modulating two independent signals from both laser sides. The operation of 2 x 56 Gb/s NRZ data with excellent eyes on a single DSEML device has been demonstrated.

The latest result of 100G DP-PAM4 system test using the DS-EML device will be shown for the first time during the presentation. By using this novel design, the researchers from HHI and Huawei successfully demonstrated a 100G single wavelength transmission system with sufficient link budget for 80km fiber without EDFA or SOA. For 100Gbps metro optical interconnection applications, a low cost and high performance module is needed among aggregation layer routers. This novel design is based on traditional EML structure, thus will have a huge advantage in size, power and transmitting distance, which will make it fit small modules like CFP2-DCO.

The paper ‘2 x 56 GB/s from a Double Side Electroabsorption Modulated DFB Laser’ (Tu3D.6) will be presented on March 22^nd afternoon. For any further information you are welcome to visit us at our booth 3013.

Chip Features and Highlights :
· Single chip supporting 2 independent channels with excellent consistency
· High bandwidth for 56Gbaud signals
· Common Active structure

· Single wavelength 100G for 80km fiber transmission without amplifiers

This article is edited by C-light Network. Please contact us if any future opportunities arise where we can be of service to you.
· Single chip supporting 2 independent channels with excellent consistency
· High bandwidth for 56Gbaud signals
· Common Active structure
· Single wavelength 100G for 80km fiber transmission without amplifiers

This article is edited by C-light Network. Please contact us if any future opportunities arise where we can be of service to you.·

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Integration of organic lasers on a silicon photonic chip